| abstract |
A film for inorganic substance deposition, comprising single or multiple resin layers, wherein all of the resin layers contain an ethylene-based polymer (A) having a melt tension (MT), as measured at 190° C., of not more than 5.0 g, and the film satisfies the following requirements: Requirement (1): the amount of a component generated by heating the film under the prescribed conditions is not more than 1.2 μg per milligram of the film; Requirement (2): the amount of a compound containing pentavalent phosphorus, said compound being recovered after washing of a surface of the film under the prescribed conditions, is not more than 9 μg; and Requirement (3): the amount of an oxide of an oligomer of a hexamer to a decamer, said oxide being recovered after washing of a surface of the film under the prescribed conditions, is not more than 1.5 μg. |