| abstract |
The method for manufacturing a light-emitting device includes flip-chip mounting a first light-emitting element and a second light-emitting element on a substrate separately from each other, bonding a first light-transmissive member to the first light-emitting element, the first light-transmissive member having a first lateral surface, and bonding a second light-transmissive member to the second light-emitting element, the second light-transmissive member having a second lateral surface, with the second lateral surface being separated from and facing the first lateral surface, scraping at least one of the first lateral surface and the second lateral surface to expose at least one of a modified first lateral surface and a modified second lateral surface, forming a light-reflective covering member on the substrate to cover the first lateral surface or the modified first lateral surface, and the second lateral surface or the modified second lateral surface, and cutting the substrate and the covering member between the first lateral surface or the modified first lateral surface, and the second lateral surface or the modified second lateral surface. |