| abstract |
A new primer for electroless plating for use in a pretreatment process of electroless plating, is environmentally friendly, can be treated in fewer process steps, and can facilitate formation of fine-pitch wiring with a width of a few μm by photolithography. A photosensitive primer for forming a metal plating film on a base material through an electroless plating process has (a) a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 1,000 to 5,000,000, (b) metal fine particles, (c) a polymerizable compound having three or more (meth)acryloyl groups in a molecule, and (d) a photopolymerization initiator. |