| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3155069b833b184bcd4ad12f7100dd4c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2291-0289
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-0681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-06 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-2418
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N29-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N29-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N29-04 |
| filingDate |
2015-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c157484e69d779811e6a1810a46e76f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5dc03dfac962665fda919a8cf262a203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a403162e95f4753b0b045f0ba418852d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aaf61d441d5900b530b2289d1349d68f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f58ddc0a65081bc135eee6ccd07ca4fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_574f8ec650bd5b4995f4002d94e2952c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bdefcad82e39922a1d91687869abd57
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34581c79d56eba6d569fad4f0b3e38f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ada21548f009fdc82bc46824709fe940 |
| publicationDate |
2017-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2017221778-A1 |
| titleOfInvention |
Non-destructive acoustic metrology for void detection |
| abstract |
Advanced interconnect technologies such as Through Silicon Vias (TSVs) have become an integral part of 3-D integration. Methods and systems and provided for laser-based acoustic techniques in which a short laser pulse generates broadband acoustic waves that propagate in the TSV structure. An optical interferometer detects the surface displacement caused by the acoustic waves reflecting within the structure as well as other acoustic waves traveling near the surface that has information about the structure dimensions and irregularities, such as voids. Features of voids, such as their location, are also identified based on the characteristics of the acoustic wave as it propagates through the via. Measurements typically take few seconds per site and can be easily adopted for in-line process monitoring. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021364476-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11668644-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021211291-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11187679-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11474059-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021262313-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022317025-A1 |
| priorityDate |
2014-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |