| abstract |
A semiconductor structure and a method for forming the same are provided. The method comprises: providing a first semiconductor workpiece; bonding a second semiconductor workpiece to a first surface of the first semiconductor workpiece; forming a first electrically conductive via through the second semiconductor workpiece to the first semiconductor workpiece; bonding a third semiconductor workpiece to a second surface of the first semiconductor workpiece, the second surface being opposite to the first surface; and forming a second electrically conductive via through the first semiconductor workpiece and the third semiconductor workpiece to the second semiconductor workpiece such that the first electrically conductive via and the second electrically conductive via are electrically connected. |