| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a62555ff12316a9a118542896b4c0af7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2251-558
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-8445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K2102-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2251-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K2102-351 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L51-5243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-841
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-8423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-8426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L51-5246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-8428
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L51-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-56 |
| filingDate |
2015-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27cf45b7a5f4e3bf1c24f97ee5ee4263 |
| publicationDate |
2017-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2017186994-A1 |
| titleOfInvention |
Organic light-emitting display panel, display apparatus containing the same, and related packaging method |
| abstract |
The present disclosure provides a method for packaging an organic light-emitting diode (OLED) display panel. The method includes providing a first substrate and a second substrate; forming a first bonding layer in a packaging region of the first substrate; and forming a second bonding layer in a packaging region of the second substrate. The method also includes bonding the first substrate with the second substrate by molecular bonding between the first bonding layer and the second bonding layer. |
| priorityDate |
2015-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |