| abstract |
An embodiment device includes a semiconductor substrate and an interconnect structure over the semiconductor substrate. The interconnect structure includes a functional circuit region and a first portion of a seal ring spaced apart from the functional circuit region by a buffer zone. The device also includes a passivation layer over the interconnect structure and a second portion of the seal ring over the passivation layer and connected the first portion of the seal ring. The second portion of the seal ring is disposed in the buffer zone. |