| abstract |
The invention is directed to a curable composition, which comprises an epoxy resin mixture, wherein the epoxy resin mixture comprisesn a) an epoxy resin; b) diethyl methyl benzene diamine (DETDA) as hardener; c) at least one compound selected from the group consisting of 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU) and 1,5-diazabicyclo[4.3.0]non-5-ene (DBN) as catalyst. |