| abstract |
Disclosed herein is an addition one part curing type heat-conductive silicone grease composition contains, as indispensable components: (A) an organopolysiloxane containing at least one alkenyl group per molecule and having a viscosity of 50 mPa•s to 100,000 mPa•s at 25° C.; (B) an organohydrogenpolysiloxane which contains at least two silicon-bonded hydrogen atoms per molecule, which has no R 2 SiO unit, which has no silicon-bonded hydrogen atom at any terminal end, which has the silicon-bonded hydrogen atoms only in a side chain or chains, and which is in a substantially straight chain form, in an amount such that the ratio of {the number of Si-H groups}/{the number of alkenyl groups in the composition} is in the range from 0.1 to 5.0; (C) a photoactive type platinum complex curing catalyst; and (D) a heat-conductive filler, wherein the composition has a viscosity at 25° C. of 30 Pa•s to 800 Pa•s as measured by a Malcom viscometer at a rotational speed of 10 rpm. n According to the present invention, there can be provided a composition which has high shape retention properties, is low in hardness, and can be stored at normal temperature. |