| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_efeafb63214175239e776dafa696b628
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cbdd96a789c29c69fa88b668e3a4a5ee |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-82103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09118 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2015-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4163a23ddeb148233fd8bd2cbc93b08d |
| publicationDate |
2017-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2017079139-A1 |
| titleOfInvention |
System, apparatus and method for utilizing surface mount technology on plastic substrates |
| abstract |
An apparatus, system and method for forming a molded plastic substrate product for an electronic circuit for a device, wherein the substrate may include one or more electrically conductive traces that are plated and formed on a laser-etched, activated portion of the molded plastic substrate defining each electrically conductive trace. One or more electrically conductive pads may be placed at one or more predetermined positions at the one or more electrically conductive traces. An electrical component surface may then be mounted to the at least one electrically conductive pad using conductive bonding material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11394077-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11581607-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111699760-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11064604-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11251497-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11349174-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-4029970-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10950913-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11081755-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10980116-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11477885-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11316227-B2 |
| priorityDate |
2015-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |