| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D1-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1603
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
2015-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec38b3c5f70168bc8b156be565823384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d638c8516c97b9c5de78bdedaea97ae3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_203708e0068fdb3391520535df78896e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5a519a476c0eea3e40e0cd292df9ba9 |
| publicationDate |
2017-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2017073815-A1 |
| titleOfInvention |
Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate |
| abstract |
A method for depositing metal or metal alloy on a substrate includes preparing a mixture including a hydroxide, a polyol solvent, a metal precursor and a complexing agent, wherein the mixture does not include water; applying the mixture to a substrate including exposed metal surfaces to selectively deposit metal onto the exposed metal surfaces of the substrate; and heating the mixture to a predetermined deposition temperature range from 120° C. and 160° C. at least one of before or after applying the mixture to the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11781028-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11578225-B2 |
| priorityDate |
2015-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |