| abstract |
The present subject matter provides a shrink film free of silicon-containing material, fluorine-containing material, and solvent-formed seams. The shrink film utilizes a water soluble layer covering an adhesive layer. The water soluble layer is in dry form and non-tacky, allowing processing of the shrink film subsequent to adhesive application to the shrink film. When the water soluble layer is dissolved, the adhesive layer is exposed and is capable of forming a permanent bond. The adhesive can be used to form a seam in the film and/or can be used to form a bond between the film and a substrate. The water soluble layer facilitates removal of an optional release liner from the adhesive. A substrate with the shrink film attached thereto and a related method of attaching a heat shrinkable film to a substrate are also disclosed. |