patent/US-2017062366-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017062366-A1

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filingDate	2015-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76ce2b06adf1a6822a3d5b2e50483488
publicationDate	2017-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2017062366-A1
titleOfInvention	Conductive barrier direct hybrid bonding
abstract	A method for forming a direct hybrid bond and a device resulting from a direct hybrid bond including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, capped by a conductive barrier, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads capped by a second conductive barrier, aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads capped by conductive barriers formed by contact bonding of the first non-metallic region to the second non-metallic region.
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