| abstract |
A method for producing a plurality of semiconductor components ( 1 ) is provided, comprising the following steps: a) providing a semiconductor layer sequence ( 2 ) having a first semiconductor layer ( 21 ), a second semiconductor layer ( 22 ) and an active region ( 25 ), said active region being arranged between the first semiconductor layer and the second semiconductor layer for generating and/or receiving radiation; b) forming a first connection layer ( 31 ) on the side of the second connection layer facing away from the first semiconductor layer; c) forming a plurality of cut-outs ( 29 ) through the semiconductor layer sequence; d) forming a conducting layer ( 4 ) in the cut-outs for establishing an electrically conductive connection between the first semiconductor layer and the first connection layer; and e) separating into the plurality of semiconductor components, wherein a semiconductor body ( 20 ) having at least one of the plurality of cut-outs arises from the semiconductor layer sequence for each semiconductor component and the at least one cut-out is completely surrounded by the semiconductor body in a top view of the semiconductor body. Furthermore, a semiconductor component is provided. |