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publicationDate 2017-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2017005051-A1
titleOfInvention Semiconductor Device And Bump Formation Process
abstract A semiconductor device includes a solder bump overlying and electrically connected to a pad region, and a metal cap layer formed on at least a portion of the solder bump. The metal cap layer has a melting temperature greater than the melting temperature of the solder bump.
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