| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76805 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
| filingDate |
2015-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b65e65c8262b12f6828276a732853bf5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8ac2a5842aea96cd48c4f67bc65fd07 |
| publicationDate |
2016-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2016358859-A1 |
| titleOfInvention |
Reducing contact resistance in vias for copper interconnects |
| abstract |
A method of forming an electrical transmission structure that includes forming an opening through an interlevel dielectric layer to expose at least one electrically conductive feature and forming a shield layer on the opening. A gouge is formed in the electrically conductive feature through the opening using a subtractive method during which the shield layer protects the interlevel dielectric layer from being damaged by the subtractive method. A contact is formed within the opening in electrical communication with the at least one electrically conductive feature. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9842768-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017221758-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11515204-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10559649-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022208606-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10381263-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10998227-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10373866-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10283404-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11574842-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10685915-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018286746-A1 |
| priorityDate |
2015-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |