| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2016-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8ac2a5842aea96cd48c4f67bc65fd07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b65e65c8262b12f6828276a732853bf5 |
| publicationDate |
2016-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2016358812-A1 |
| titleOfInvention |
Reducing contact resistance in vias for copper interconnects |
| abstract |
A method of forming an electrical transmission structure that includes forming an opening through an interlevel dielectric layer to expose at least one electrically conductive feature and forming a shield layer on the opening. A gouge is formed in the electrically conductive feature through the opening using a subtractive method during which the shield layer protects the interlevel dielectric layer from being damaged by the subtractive method. A contact is formed within the opening in electrical communication with the at least one electrically conductive feature. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11387168-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10930548-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10700163-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020127089-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10832947-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020235004-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022157720-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10957762-B2 |
| priorityDate |
2015-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |