| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-28 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2016-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87bb3e78a75a173586cc1295d23199d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_289e8748cb5c9417b1cc93c3818a4f46 |
| publicationDate |
2016-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2016340470-A1 |
| titleOfInvention |
Liquid resin composition |
| abstract |
Provided is a resin composition superior in reliability and capable of forming a cured product exhibiting a small degree of heat decomposition (weight reduction) even when left under a high temperature of 200 to 250° C. for a long period of time and superior mechanical properties even under a high-temperature and high-humidity environment. The composition is a liquid resin composition comprising:n (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenol curing agent containing a resorcinol-type phenolic resin (C) an epoxy resin; and (D) a curing accelerator, in whichn nthe cyanate ester compound (A) is in an amount of 30 to 80 parts by mass with respect to 100 parts by mass of a sum total of the cyanate ester compound (A), the phenol curing agent (B) and the epoxy resin (C). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10385203-B2 |
| priorityDate |
2015-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |