http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016299332-A1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8fd1e4193f0f5eb58621db6ec20566a5 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0145 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B26-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G09G3-3466 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B26-00 |
filingDate | 2015-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cabd1525ba3293b26c3e098a28669c5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c4fa759ddd1c0a696e4a59ee442b55d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a24ef0a839925e16402357081f651097 |
publicationDate | 2016-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | US-2016299332-A1 |
titleOfInvention | Pre-release encapsulation of electromechanical system devices |
abstract | This disclosure provides systems, methods and apparatus for packaging an array of electromechanical systems (EMS) devices such as interferometric modulators (IMODs). In one aspect, a backplate including an aperture can be sealed to a substrate supporting an array of unreleased EMS devices to form a package. A release etch may be performed through the aperture after sealing the backplate to the substrate. By performing the release etch after sealing the backplate to the substrate, the effect on the array of EMS devices of the formation and outgassing of the sealant material can be reduced. |
priorityDate | 2015-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.