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publicationDate 2016-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2016276218-A1
titleOfInvention METHOD OF MANUFACTURING Cu WIRING
abstract In a Cu wiring manufacturing method, a MnO x film which becomes a self-formed barrier film by reaction with an interlayer insulating film of a substrate is formed on a surface of a recess formed in the interlayer insulating film by ALD. A hydrogen radical process is performed on a surface of the MnO x film to reduce the surface of the MnO x film. A Ru film is formed by CVD on the surface of the MnO x film which has been reduced by the hydrogen radical process. A Cu-based film is formed on the Ru film by PVD to be filled in the recess. When the Ru film is formed, a film-formation condition of the MnO x film and a condition of the hydrogen radical process are set such that nucleus formation is facilitated and the Ru film is formed in a state where a surface smoothness is high.
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