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publicationDate 2016-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2016260681-A1
titleOfInvention Interfacial alloy layer for improving electromigration (em) resistance in solder joints
abstract A method of forming a structure for an interfacial alloy layer which is able to improve the electromigration (EM) resistance of a solder joint. More specifically, in this structure, a controlled interfacial alloy layer is provided on both sides of a solder joint. In order to form this structure, aging (maintenance of high-temperature conditions) is performed until an interfacial alloy layer of Cu3Sn has a thickness of at least 1.5 μm.
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