| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_026b10a888a2d30962e2bfb7e8d86868 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F1-203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-2039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F1-20 |
| filingDate |
2016-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b30eeb533200b902db9e7f75fab665a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e5c52d3e29d2e8dff7cc9252d040752 |
| publicationDate |
2016-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2016212841-A1 |
| titleOfInvention |
Systems, structures and materials for electronic device cooling |
| abstract |
An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9861015-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10477724-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021340370-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10415474-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11445595-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021010628-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016270254-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10234752-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11016546-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014268564-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11725105-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020150732-A1 |
| priorityDate |
2012-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |