Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-024 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-0207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4284 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
filingDate |
2015-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fcecefe00376f6dc8003f968f568671 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c4fcfe0e6cf3672ecf3a3e431f1958f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ded3a9e6ce6a773a5cb2c732bced5db2 |
publicationDate |
2016-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2016208143-A1 |
titleOfInvention |
Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring board |
abstract |
A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11582872-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111849122-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108530647-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114106514-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108586707-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108503841-A |
priorityDate |
2015-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |