Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ab63e543a193d98caecd60100ea272a0 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0136 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0242 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-097 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01C19-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01C19-5783 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01C19-00 |
filingDate |
2014-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7eec9ae8362d7e1c1b45b5e50a8b2e5f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5e11bd132d392f56472686390fdd977 |
publicationDate |
2016-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2016178372-A1 |
titleOfInvention |
Gyro MEMS Sensor Package |
abstract |
An integrated circuit packaging structure comprises at least one Micro Electrical Mechanical Systems (MEMS) gyroscope die mounted directly on a multi-layer flexible substrate having at least one metal layer and wire-bonded to the flexible substrate and a lid or die coating protecting the MEMS die and wire bonds. |
priorityDate |
2014-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |