| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-619
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-02 |
| filingDate |
2014-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57b6c320da24fcf643eb534d04530002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e897426cd1517b1e930b906aab118a34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abc0acafaa7ef948c0331a686b84fa0b |
| publicationDate |
2016-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2016177467-A1 |
| titleOfInvention |
Apparatus and process of electro-chemical plating |
| abstract |
An electro-chemical plating process begins with supplying a supercritical fluid into an electroplating solution to be deposited, and a bias is applied between a substrate and an electrode, which is located in the electroplating solution. The substrate is placed into the electroplating solution to deposit a material on the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023084019-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11664231-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108130587-A |
| priorityDate |
2014-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |