http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016161416-A1

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filingDate 2015-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7ec6c5e6d50a7c41aabe645dd1f4de4
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publicationDate 2016-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2016161416-A1
titleOfInvention Method of accurate thickness measurement of boron carbide coating on copper foil
abstract A method is disclosed of measuring the thickness of a thin coating on a substrate comprising dissolving the coating and substrate in a reagent and using the post-dissolution concentration of the coating in the reagent to calculate an effective thickness of the coating. The preferred method includes measuring non-conducting films on flexible and rough substrates, but other kinds of thin films can be measure by matching a reliable film-substrate dissolution technique. One preferred method includes determining the thickness of Boron Carbide films deposited on copper foil. The preferred method uses a standard technique known as inductively coupled plasma optical emission spectroscopy (ICPOES) to measure boron concentration in a liquid sample prepared by dissolving boron carbide films and the Copper substrates, preferably using a chemical etch known as ceric ammonium nitrate (CAN). Measured boron concentration values can then be calculated.
priorityDate 2014-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 28.