| abstract |
A device comprises a first chip comprising a plurality of first interconnect structures over a first substrate, a plurality of first connection pads over the plurality of first interconnect structures and a plurality of first bonding pads, wherein a first bonding pad is formed over a corresponding first connection pad, and a second chip comprising a plurality of second interconnect structures over a second substrate and a plurality of second bonding pads over the plurality of second interconnect structures, wherein the first chip and the second chip are face-to-face bonded together, and wherein a first bonding pad is in direct contact with a corresponding second bonding pad. |