| abstract |
The present invention relates to a composition for forming a conductive pattern which is capable of forming a fine conductive pattern reducing deterioration of mechanical-physical properties and having excellent adhesion strength onto a variety of polymeric resin products or resin layers, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming a conductive pattern includes a polymer resin; and non-conductive metal compound particles including a first metal element and a second metal element, having a R 3 m or P6 3 /mmc space group in crystal structure, and having a particle size of 0.1 to 20 μm, wherein a metal nuclei including the first metal or the second metal element or an ion thereof is formed from the non-conductive metal compound particles by electromagnetic irradiation. |