http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016090448-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_154f5a8a983d88f296117dcc92946ab4 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-30 |
| filingDate | 2014-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e006909c56d86f122f2af781fffbe0fc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79de6f03530e9962388038f7bfbd6cb1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c11a93f0a7c413ebcfb972d78874ca3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_185025bf02377ccf00f7bf7562b369c0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5770a299d2d0edeb822bbd289fe9afe2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7eb765f2701bbf9cb170fccbdbb42c04 |
| publicationDate | 2016-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2016090448-A1 |
| titleOfInvention | Copolymerized Polyamide Resin, Method for Preparing the Same and Molded Article Comprising the Same |
| abstract | A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R 1 is independently a C 1 to C 5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C 1 to C 10 hydrocarbon group, R 2 and R 3 are each independently a C 1 to C 5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process. |
| priorityDate | 2014-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 105.