| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2886
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07342
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07378 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07314
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2887
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-26 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 |
| filingDate |
2014-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28a2edc1110a8b9795bb6f6390c99e6a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db03501a6b9f568bda927ba73f0f7554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0828939c1889f21bb49c2f14af4d8f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd0d3936d9a4ea573da6a7d7427cf6c7 |
| publicationDate |
2016-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2016061882-A1 |
| titleOfInvention |
Probe device |
| abstract |
A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11293975-B2 |
| priorityDate |
2013-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |