| abstract |
There is provided a one -part curable epoxy composition comprising a heat curable epoxy resin; and a latent curative system in an amount sufficient to cure the epoxy resin, where the latent curative system comprises at least one epoxy resin miscible first curative comprising a latent hardener, selected from dicyandiamide and its derivatives, and two or more latent accelerators selected from at least one of substituted ureas, substituted imidazoles, and combinations thereof. There are also provided adhesive compositions, cured adhesives and articles made using such one-part curable epoxy compositions. |