| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ed50b371591b10b47d9ef549044d728 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
| filingDate |
2014-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e36e23faba620cb6e2a23f0cc2ed9fd0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_391c40d3a6642ec3a2089c1bd03c5f56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f245f932ea90680ca1d2e571836f25d |
| publicationDate |
2016-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2016040296-A1 |
| titleOfInvention |
Electroless gold plating liquid |
| abstract |
The present invention relates to an electroless gold plating liquid, which may form gold plating without corrosion of a base metal by performing substitution and reduction reactions in the same bath, and satisfy both weldability of lead-free soldering and wire bonding characteristics, and has excellent stability such that a gold deposition rate may be continuously maintained. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114481107-A |
| priorityDate |
2014-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |