| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3227 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2015-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87bb3e78a75a173586cc1295d23199d6 |
| publicationDate |
2016-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2016040048-A1 |
| titleOfInvention |
Liquid epoxy resin composition and adhesive agent for heatsink and stiffener |
| abstract |
Provided is a highly reliable adhesive agent for heatsink or stiffener, obtained by improving a conventional epoxy resin composition. The invention is a liquid epoxy resin composition exhibiting a viscosity of 50 to 1,000 Pa·s when measured by an E-type viscometer at 25° C., and including a liquid epoxy resin exhibiting a viscosity of 0.1 to 1,000 Pa·s when measured as above; a liquid phenol-based curing agent without siloxane bond and exhibiting a viscosity of 0.1 to 100 Pa·s when measured as above; a curing accelerator selected from tetraphenylphosphine, imidazole and tertiary amine; an inorganic filler treated with a silane coupling agent and exhibiting an average particle diameter of 0.1 μm or larger; thermoplastic resin particles being solid at 25° C.; and a silica treated with a silane coupling agent having a nonreactive functional group, and exhibiting an average particle diameter of not smaller than 0.005 μm but smaller than 0.1 μm. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023178472-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113461901-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111286289-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10253223-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113462128-A |
| priorityDate |
2014-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |