Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c943ee5f76f0b8cdffeb12667b59f37e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00682 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
filingDate |
2015-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43abd83c4963e92c3fe8ee8130af596a |
publicationDate |
2016-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2016039663-A1 |
titleOfInvention |
Chip package and method of manufacturing the same |
abstract |
A method includes forming a bump on a lower surface of an interposer. A first insulation layer is formed to cover the lower surface and bump. A trench is formed extending from the lower towards an upper surface of the interposer. A polymer supporting adhesive layer is formed to surround the bump and couples between the interposer and a semiconductor chip. The semiconductor chip has at least a sensing component and a conductive pad electrically connected to the sensing component, and the bump is connected to the conductive pad. A via is formed extending from the upper towards the lower surface. A second insulation layer is formed to cover the upper surface and the via. A redistribution layer is formed on the second insulation layer and in the via. A packaging layer is formed to cover the redistribution layer and has a second opening. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016351494-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10090241-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10882737-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9478500-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111584695-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017164816-A1 |
priorityDate |
2014-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |