| abstract |
A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 12 weight percent, all based on weight of the curable silicone composition; wherein the curable silicone composition has a concentration of the Cu—Ag core-shell particles and hydrocarbon vehicle such that the curable silicone composition remains curable to a conductive silicone material having a concentration of the Cu—Ag core-shell particles of from 88.0 to 92 weight percent and having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method, and a thermal conductivity of greater than or equal to 2.9 Watts per meter*Kelvin (W/(m*K)) measured according to Thermal Properties Test Method. |