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publicationDate 2016-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2016016789-A1
titleOfInvention Thin film structure for hermetic sealing
abstract The present disclosure relates to a MEMS device with a hermetic sealing structure, and an associated method. In some embodiments, a first die and a second die are bonded at a bond interface region to form a chamber. A conformal thin film structure is disposed covering an outer sidewall of the bond interface region to provide hermetic sealing. In some embodiments, the conformal thin film structure is a continuous thin layer covering an outer surface of the second die and a top surface of the first die. In some other embodiments, the conformal thin film structure comprises several discrete thin film patches disposed longitudinal.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021126563-A1
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