| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6a48a4f50aac9601ab656de3a5e603f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49149
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4817
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-08 |
| filingDate |
2015-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e991d65c4a22766b65164b441ccb0fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01d4cc4b902cadcaf008b3fcea08953f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6d601633b0b380294dfec730a416ba2 |
| publicationDate |
2015-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015359121-A1 |
| titleOfInvention |
Package and method for fabricating package |
| abstract |
A package that hermetically seals an integrated circuit includes a metal lid 7 and a metal housing 10 having an open upper portion. In the package, the housing 10 includes in a wall surface thereof a glass unit 2 that seals a plurality of lead terminals therein. The glass unit 2 is disposed in a wall surface of the housing 10 such that a thickness in a vertical direction of the wall surface on an upper side of the glass unit 2 is determined according to a threshold limit value of a difference in temperature between glass that forms the glass unit 2 and metal that forms the wall surface. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018159814-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6319490-B1 |
| priorityDate |
2014-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |