| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0886d990612a64b2c2040e9779f38ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-692
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F15-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00333
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-6845 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01F15-16 |
| filingDate |
2013-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c351efbce7c9888b8c0c696f065a626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b7818bd05aaa1b8e6f882403372b20e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a068ef14e7a8f90948bd0a618ace5c86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e36bb97486caf908cae05a6b7a5f93fe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9caf0818a346936f9441a398e73cc7d8 |
| publicationDate |
2015-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015338258-A1 |
| titleOfInvention |
Flow Sensor and Manufacturing Method for the Same |
| abstract |
When an exposed part of a semiconductor chip is reduced in size, a tendency of development of a crack on the semiconductor chip is suppressed. A pressure of injection of a resin MR into a second space creates a gap on a contact part SEL where an elastic film LAF and a semiconductor chip CHP 1 are in contact, and a resin MR 2 different in constituent from the resin MR infiltrates into the gap. As a result, in an area of semiconductor chip CHP 1 that is exposed from the resin MR, the resin MR 2 is formed in an area other than a flow detecting unit FDU and an area around it. Hence, an area of semiconductor chip CHP 1 that is exposed from the resins MR and MR 2 can be reduced in size. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10876872-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021396561-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10935403-B2 |
| priorityDate |
2013-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |