| abstract |
A novel method of producing an encapsulated light emitting device. A preferred mold release film that can be used during the encapsulation of a LED chip has an elastic modulus and a glass transition temperature that are low enough as compared to the desired molding temperature that the release film will closely conform to the interior of the molding cavities used to form a protective lens surrounding an LED chip. A preferred release film according to embodiments of the present invention comprises a fully fluorinated polymer, such as a perfluoroalkoxy polymer, including MFA, or fluorinated ethylene propylene. |