| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C2029-5602 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0491
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-318511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C29-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate |
2015-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0eef0e2be3b16753d225137020e25d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4ad1f076559bdc6d6165ed13323d3c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00bbbf116c2bea1829567d4f58c251b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5be3f8f3256bd449733908c7211dc09c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ecc0473461745ebfe1b42c99b58f626 |
| publicationDate |
2015-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015316603-A1 |
| titleOfInvention |
De-Embedding On-Wafer Devices |
| abstract |
An apparatus includes three components. The first component includes a first transmission line; the second component is coupled with the first component and includes a second transmission line; and the third component electrically coupled with the first component and/or the second component. The transmission lines each include a substrate with a p-well or n-well within the substrate and a shielding layer over the p-well or n-well. The transmission lines also each include a plurality of intermediate conducting layers over the shielding layer, the plurality of intermediate conducting layers coupled by a plurality of vias. The transmission lines further each include a top conducting layer over the plurality of intermediate conducting layers. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021031424-A1 |
| priorityDate |
2008-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |