| abstract |
One of the purposes of the present invention is to provide an silicone adhesive composition which comprises no antioxidant, has sufficient adhesive, tack properties and excellent heat resistance, and provides a silicone adhesive composition which has no adhesive residue in a test described below. The other purpose of the present invention is to provide an adhesive film and an adhesive tape having a cured layer obtained from the composition. The present invention provides an addition curable or peroxide curable silicone adhesive composition, wherein n the addition curable silicone adhesive composition comprisesn (A1) a diorganopolysiloxane having an alkenyl group and a viscosity at 25 degrees C. of 100,000 mPa·s or more, (B) an organopolysiloxane having R 1 3 SiO 0.5 units and SiO 2 units, wherein R 1 is a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms, (C) an organchydrogenpolysiloxane having at least three SiH groups, (D) optionally an addition reaction inhibitor, (E) a platinum group metal catalyst for an addition reaction, and (F) an organic solvent, andn nthe peroxide curable silicone adhesive composition comprisesn (A2) a diorganopolysiloxane having a viscosity at 25 degrees C. of 100,000 mPa·s or more and may or may not have an alkenyl group, (B) an organopolysiloxane having R 1 3 SiO 0.5 units and SiO 2 units, wherein R 1 is a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atom, (F) an organic solvent, and (G) an organic peroxide,n nand components (A1) and (A2) may be accompanied with octamethylcyclotetrasiloxane and/or decamethylcyclopentasiloxane and each content of octamethylcyclotetrasiloxane and decamethylcyclopentasiloxane is less than 0.1 mass %, based on a total amount of component (A1) or (A2), component (B) and octamethylcyclotetrasiloxane and decamethylcyclopentasiloxane. |