| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_78a494fa5f7b444e5177e22ae809a0d8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0485 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3478
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-365
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3457
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 |
| filingDate |
2014-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76e629ce11812b59db24c862f556f1de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84ebb079be6b671dd21d63efb3ae1509 |
| publicationDate |
2015-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015257279-A1 |
| titleOfInvention |
Solderable conductive polymer thick film composition |
| abstract |
A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018063967-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10844238-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11472980-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11746246-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018079030-A1 |
| priorityDate |
2014-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |