| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31551 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10 |
| filingDate |
2013-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f89a4af39dd9dacc3355fd95ae0168a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97eda3b68efb8b05786fc55e6b612a18 |
| publicationDate |
2015-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015240071-A1 |
| titleOfInvention |
Curable resin composition, composition for forming solder resist, dry film and printed wiring board, and laminate and process for preparing the same |
| abstract |
The present invention provides a curable resin composition that can provide a cured material excellent in insulation reliability while maintaining adhesiveness and provide a composition for forming a solder resist, a dry film and a printed wiring board, a laminate having a resin insulating layer excellent in insulation reliability while maintaining adhesiveness, a dry film for forming this and a process for preparing a laminate using the dry film. The curable resin composition contains (A) an imidazole-isocyanate adduct, (B) a carboxyl group-containing resin and (C) a thermosetting resin. The above laminate has a substrate and a plurality of resin insulating layers formed on the substrate, in which one of the plural resin insulating layers in contact with the substrate is a layer formed of the curable resin composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11643545-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9891523-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10599034-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10717808-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015382473-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10031415-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111683472-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10093768-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112322138-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11614574-B2 |
| priorityDate |
2012-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |