| abstract |
This invention relates to a method of manufacturing a buried flexible electrode film, including 1) preparing a release-substrate; 2) forming a conductive pattern layer on the release-substrate; 3) positioning a transfer-substrate on the conductive pattern layer and then performing thermal and pressure lamination so that the conductive pattern layer formed on the release-substrate is inserted or buried in the surface of the transfer-substrate; and 4) separating the release-substrate and the conductive pattern layer from each other, and to a buried flexible electrode film manufactured thereby. |