| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a6a73440018eca5d3e92ae110c26dbb1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L85-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L85-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 |
| filingDate |
2014-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a194bbc072d8b680172101ba8d84fae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_419d1067bb7dda67300f082d7d70259e |
| publicationDate |
2015-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015189744-A1 |
| titleOfInvention |
Thermosetting resin composition and usage thereof |
| abstract |
The present invention relates to a thermosetting resin composition, wherein the resin composition comprises of: (A) epoxy resin; (B) active ester curing agent; (C) poly-phosphonate ester and/or phosphonate-carbonate copolymer. The prepreg and copper clad laminate prepared with the thermosetting resin composition mentioned above has excellent dielectric performance, wet-heat resistance performance, and a flame resistance performance of UL 94 V-0 level. |
| priorityDate |
2013-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |