| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 |
| filingDate |
2013-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dc77d279af7111f328513cc9a13a785
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66895b8ef60803b87f120e5a6f1611d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_098fade92ab809179dc4e98a74550d3b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea7935d4f07952e4a0f92e53f46aa182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16b49e501b6bcc23e6fbc27b65ba31c0 |
| publicationDate |
2015-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015179494-A1 |
| titleOfInvention |
Method for producing semiconductor device |
| abstract |
A method for producing a semiconductor device having a semiconductor element obtained by dividing a semiconductor wafer comprises a temporary securing step of arranging a temporary securing film between a support member and the semiconductor wafer so as to temporarily secure the support member and the semiconductor wafer to each other; a grinding step of grinding a surface on the side opposite from the temporary securing film of the semiconductor wafer temporarily secured to the support member, and a semiconductor wafer peeling step of peeling the temporary securing film from the ground semiconductor wafer, wherein a semiconductor wafer edge-trimmed on an outer peripheral part of a surface opposing the support member is used as the semiconductor wafer, and the temporary securing step arranges the temporary securing film on the inside of the edge-trimmed part. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10941320-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110546746-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11742243-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10177022-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11482506-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015380327-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9640451-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022148922-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3187559-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10192769-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10988647-B2 |
| priorityDate |
2012-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |