| abstract |
The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatus comprises a bonding roll comprising a base surface and plurality of nubs extending from the base surface, each of the plurality of nubs comprising: a sidewall; a bonding surface; and a shoulder connecting the sidewall to the bonding surface. The shoulder comprises a single chamfer or a radius to, inter alia, reduce tearing of the substrates. |