http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015136609-A1
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-06 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-002 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-16 |
filingDate | 2014-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_851e2c94a4083c0d3e8ee96cb2497fb9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6dd1c7459e7381125fb87da4168d9432 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5e9575084dab9bb13e8a22271ed22fb |
publicationDate | 2015-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | US-2015136609-A1 |
titleOfInvention | Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD |
abstract | An Sn alloy plating apparatus is disclosed which can relatively easily perform control of an Sn alloy plating solution, including control of the Sn ion concentration and the acid concentration of the plating solution. The Sn alloy plating apparatus includes: a plating bath configured to hold therein an Sn alloy plating solution in which an insoluble anode a the substrate are to be disposed opposite each other; a plating-solution circulation line configured to circulate the Sn alloy plating solution in the plating bath; an Sn supply reservoir configured to draw a part of the Sn alloy plating solution from the plating-solution circulation line, perform electrolysis in a presence of the Sn alloy plating solution to replenish the Sn alloy plating solution with Sn ions and an acid that stabilizes Sn ions, and return the Sn alloy plating solution that has been replenished with the Sn ions to the plating bath; and a dialysis unit configured to draw a part of the Sn alloy plating solution from the plating-solution circulation line, remove the acid from the Sn alloy plating solution, and then return the Sn alloy plating solution to the plating bath. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018274123-A1 |
priorityDate | 2013-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.