| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1eb9cd2af2f87dcf20b0fbbdfe79996e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-04 |
| filingDate |
2014-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12c53e3f117651c808e89ed8778bf9d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9bbae66a5e690389f0d1aebf521dd10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb27528c6e4cd2b7ce6051c8794dc2e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_507c13272dde72e944283a574de5e78f |
| publicationDate |
2015-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015096883-A1 |
| titleOfInvention |
Apparatus for wetting pretreatment for enhanced damascene metal filling |
| abstract |
Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9435049-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9852913-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9828688-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112708926-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11542619-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10301738-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10840101-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9455139-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9677188-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9617648-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10128102-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9613833-B2 |
| priorityDate |
2009-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |