| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9cb217f83556ce2a418344c2d485415 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2079-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-007 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2014-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_391f8b66f4823d5d66ac9fcc60643308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a426a5a2bed30320892b3b030712c17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f6ea51600d7434671ebdd74588a5d65 |
| publicationDate |
2015-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015069012-A1 |
| titleOfInvention |
Polyimide film and wiring board |
| abstract |
A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film. |
| priorityDate |
2007-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |